Reliability of Ag Nanoporous Bonding Joint for High Temperature Die Attach under Temperature Cycling
نویسندگان
چکیده
منابع مشابه
Die Attach for High Temperature Electronics Packaging
AuSi, patterned Au and off-eutectic Sn-Au-Sn die attach materials and processes have been investigated for SiC die attach for high temperature applications. AuSi shear test results after 3000 hours of aging at 325C in air showed only a slight decrease in shear strength when assembled on Mo:Mn/Pd/Au metallized AlN. However, when assembled on Mo:Mn/Ni/Au metallized AlN, the die shear strength dec...
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Silver sintering joints and AuGe soldering are promising technologies for high temperature (>200 C ambient) power electronics packaging. This paper presents the implementation of two silver-sintering processes with the one hand micrometer-scale silver particles, and on the other hand nano-meter-scale particles. Two substrates technologies have been investigated: A12O3 DBC and Si3N4 AMB. After t...
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Power cycle reliability of Cu nanoparticle joint has been studied for high temperature operation of power devices. Al2O3 heater chips and Cu–65 wt% Mo baseplates were joined by Cu nanoparticles and Sn–0.7Cu and power cycle tests of 65/200 C and 65/250 C were carried out on the joints. The Cu nanoparticles were prepared by reducing Cu carbonate in ethylene glycol with dodecanoic acid + dodecyl a...
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ژورنال
عنوان ژورنال: MATERIALS TRANSACTIONS
سال: 2016
ISSN: 1345-9678,1347-5320
DOI: 10.2320/matertrans.md201518